2008 17th World Conference on Nondestructive Testing
September
23,
2008
Spellman High Voltage Electronics Corp. and Spellman High Voltage (SIP) Co. Ltd. are proud to announce that they will be exhibiting at the upcoming 17th World Conference on Nondestructive Testing, to be held on October 25-28, 2008 in Shanghai, China, at the Shanghai Exhibition Center, Booth C355.